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75639S3S TDA98 40360 RXF0EID0 2000D 2FSC7 124SIL PIC1F628
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  Datasheet File OCR Text:
 LED - Chip
discontinued Radiation Infrared Type DDH 6/21/2007 Technology AlGaAs/AlGaAs
ELC-875-22
rev. 06/07 Electrodes N (cathode) up
650 O110
typ. dimensions (m)
typ. thickness 180 m
480
anode gold alloy, 1.5 m cathode gold alloy, 0.5 m dotted, 25% covered
LED-07
Optical and Electrical Characteristics
Tamb = 25 unless otherwise specified C, Test Parameter conditions Forward voltage Forward voltage Reverse voltage Radiant power1 Radiant power2 Radiant power3 Radiant intensity1 Peak wavelength Spectral bandwidth at 50% Switching time
1 2
Measured on bare chip on TO-18 header Measured onbare chip on TO-18 header and heat sink 3 Measured on epoxy chip on TO-18 header and heat sink, 10s current flow (information only)
25
Symbol VF VF VR e e e e p 0.5 tr , tf IF = 20 mA IF = 100 mA IR = 100 A IF = 20 mA IF = 100 mA IF = 100 mA IF = 20 mA IF = 100 mA IF = 100 mA IF = 100 mA
Min
Typ 1.2 1.45
Max 1.4 1.8
Unit V V V
5 2.5 3.5 17 35 0.75 860 1.0 875 45 20 890
mW mW mW mW/sr nm nm ns
Labeling
Type EL-875-22 Lot N e(typ) [mW] VF(typ) [V] Quantity
Packing: Chips on adhesive film with wire-bond side on top
Note: All measurements carried out with EPIGAP equipment
EPIGAP Optoelektronik GmbH, D-12555 Berlin, Kopenicker Str.325 b, Haus 201 Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
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